Specifications | · Cu <111> coated Si Wafer (4 inch size) · Thickness of highly oriented polycrystalline Cu <111> film: 400 nm · Thickness of Ta diffusion barrier: 20-50 nm · 4 inch dia x0.525 mm thickness Si wafer (Prime Grade) with thermal oxide: 300 nm thk · P type, B doped, <100> orientation, SSP · Resistivities: 1-20 ohm-cm · Surface Roughness: as grown , N/A · Package: One 1000 class clean room with 100 class plastic bag |